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ASMPT Xtreme GoCu

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General Information

Supplier Name ASMPT
Type/Group Wire Bonder
Model Xtreme GoCu
Dimension [mm] 720 x 820 x 1750
Weight [Kg] 730
Power consumption [KW] 1.5
Lead time [Weeks] 21
Standard Price [USD] 85000
Website Link https://www.asmpt.com/

Specification

2D Strip Map Yes
Contact Detection Mode F Mode
BITS Capacity DC Mode : Max 10 MΩ
AC Mode : Min 0.4pF
USG Frequency Analog USG
Programmable Optic Auto Focus Optic
Min Pad Pitch [㎛] 35 (Mass), 30(Lab)
 Bonding Speed  [msec/wire] 43
 Bonding Accuracy [㎛] ±2.0(3δ)
  Bond Head Driving Type Linear Voice Coil Motor
 Z Resolution [㎛] 0.1
  XY Table Driving Type Linear Motor
XY Resolution [㎛] 0.05
 PRS Accuracy [㎛] ±0.37
 Frequency [KHz] 138(High)/73(Low)
 Transducer Material Stainless
 Bonding Area [mm] 56.0 X 70.0
 Max Wires Q’ty 5,000
 Max Wire Length [mm] 8.0
Operating system Windows XP
 Wire Size 0.5 ~ 2.0 mil
 Leadframe handling size Length [mm] 140 ~ 295
 Leadframe handling size Width [mm] ~ 92
 Leadframe handling size  Thickness [mm] 0.1 ~ 0.8
 Magazine Length [mm] 140 ~ 295
Magazine Width [mm] 16 ~ 100
Magazine Height [mm] 55 ~ 180
Compressed Air 12¢ / 140 LPM /5 bar
Option 1
Option 2
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Additional Comment
Efficient survey

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