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KnS Rapid MEM (LA)

K&S GEN-S SERIES AUTOMATIC WIRE BONDER

RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

Key Features:

Real-time Process & Performance Monitoring
Real-time Equipment Health Monitoring
Advanced Data Analytics & Traceability
Predictive Maintenance Monitoring & Analysis
Detection & Enhanced Post bond Inspection
Latest Response Based Processes

Bondable Area Configurations:

RAPID MEM LA (Large Area)
RAPID MEM ELA (Extended Large Area)

Categories: BONDER, EOL/PACKAGING

설명

General Information

Supplier Name	KnS
Type/Group	Wire Bonder
Model	Rapid MEM (LA)
Dimension [mm]	889 x 990 x 1750
Weight [Kg]	590
Power consumption [KW]	1.5(Normal) / 2.6(Max)
Lead time [Weeks]	20
Standard Price [USD]	84000
Released date	Aug-19
Website Link	https://www.kns.com/

Detail Specification

2D Strip Map	Yes
Contact Detection Mode	V, P, F Mode
BITS Capacity	DC Mode : Max 15 MΩ AC Mode : Min 0.1pF
USG Frequency	Digital USG Dual Frequency
Programmable Optic	Auto Focus Optic
Min Pad Pitch [㎛]	40 (with 0.6mil Cu) 35 (with 0.6mil Au)
Bonding Speed [msec/wire]	46.1
Bonding Accuracy [㎛]	±2.0(3δ)
Bond Head Driving Type	Linear Voice Coil Motor
Z Resolution [㎛]	0.125
XY Table Driving Type	Linear Motor
XY Resolution [㎛]	0.1
PRS Accuracy [㎛]	±0.5
Frequency [KHz]	120(High)/50(Low)
Transducer Material	Titanium
Bonding Area [mm]	56.0 X 80.0 56.0 X 87.0 (LA)
Max Wires Q’ty	7,000(Single)/25,000(Matrix)
Max Wire Length [mm]	7.6
Operating system	Windows XP / VxWorks
Wire Size	0.6 ~ 2.5mil
Leadframe handling size Length [mm]	90 ~ 300
Leadframe handling size Width [mm]	15.2 ~ 92
Leadframe handling size Thickness [mm]	0.1 ~ 1.10
Magazine Length [mm]	127 ~ 305
Magazine Width [mm]	20 ~ 98
Magazine Height [mm]	50 ~ 178
Compressed Air	10￠ / 142 LPM / 55 PSI
Option 1
Option 2
Option 3
Option 4
Option 5
Additional Comment